← Back to papers
Superconducting Through-Silicon Vias for Quantum Integrated Circuits
M. Vahidpour, W. O'Brien, J. Whyland, J. Angeles, J. Marshall, D. Scarabelli, G. Crossman, K. Yadav, Y. Mohan, C. Bui, V. Rawat, R. Renzas, N. Vodrahalli, A. Bestwick, C. Rigetti·August 7, 2017
Materials SciencePhysics
AI Breakdown
Get a structured breakdown of this paper — what it's about, the core idea, and key takeaways for the field.
Abstract
We describe a microfabrication process for superconducting through-silicon vias appropriate for use in superconducting qubit quantum processors. With a sloped-wall via geometry, we can use non-conformal metal deposition methods such as electron-beam evaporation and sputtering, which reliably deposit high quality superconducting films. Via superconductivity is validated by demonstrating zero via-to-via resistance below the critical temperature of aluminum.